The Blu-ray Disc Association (BDA) has announced its plans for incorporating 3D into the Blu-ray Disc format.
07/09/2009
Its RAFT technology enables the development of complex molecules through a polymerisation process that can be used for a range of products.
09/07/2010
The companies formed a 50:50 joint venture to work on developing photovoltaic technology.
18/01/2010
According to TSMC, it collaborates with multiple EDA vendors to create and validate interoperable EDA formats.
12/04/2010
The company said the technology will be based on a planar process with enhanced high-K metal gate, novel strained silicon, and low-resistance copper Ultra-Low-K interconnects.
16/04/2010
The company said the move will position it for a range of PCI Express solutions.
04/11/2009
According to Altium, the agreement adds an extra dimension for electronics designers working with FPGAs.
28/05/2010
Memory chip supplier Qimonda says it is about to begin commercial production of DRAM chips using its new “Buried Wordline” technology.
24/11/2008
Distributor Premier Farnell has launched element14, which the company claims is a “new online technology resource and community for electronic design engineers”.
30/06/2009
An alliance of IBM, Chartered Semiconductor, Infineon Technologies, Samsung and STMicroelectronics says it has defined and is jointly developing a 28 nm, high-k metal gate (HKMG), low-power bulk complementary metal oxide semiconductor (CMOS) process.
04/05/2009
Immersion Corp. announced that its TouchSense haptics technology is available to developers who want to integrate touch feedback into applications on the Nokia N900 mobile computer, based on Maemo software.
09/10/2009
Dongbu HiTek said the BCDMOS technology supports 60 V and high applications.
08/04/2010
Micron says that analyst Semiconductor Insights (SI) has selected two of its DRAM and NAND innovations as the winners in the Eighth Annual Insight Awards program.
27/04/2009
TSMC is evaluating EUV and other lithography technologies for their potential to optimise cost-effective manufacturing at future technology nodes.
23/02/2010
A group of technology companies has announced the Wireless Gigabit (WiGig) Alliance, an organisation formed to establish a unified specification for 60 GHz wireless technologies.
19/05/2009
STMicroelectronics announced a new secure microcontroller (MCU) based on embedded Flash memory, which is the first in the world to be produced using 90nm (90 nanometer) process technology.
14/11/2007
It is expected the electronics technology will be deployed in the next BMW 1-and 3-Series and on the new X3 platform.
22/06/2010
Continua Health Alliance, the non-profit, open industry coalition of health care and technology companies, has selected Bluetooth low energy and ZigBee low power wireless standards for inclusion in the next version of its interoperability Design Guidelines.
11/06/2009
A prime example of Australian innovation using the IP system is the CSIRO’s Wi-Fi technology patented in 1996.
27/04/2010
STMicroelectronics, STATS ChipPAC, and Infineon Technologies AG have signed an agreement to jointly develop the next-generation of embedded Wafer-Level Ball Grid Array (eWLB) technology, based on Infineon’s first-generation technology, for use in manufacturing future-generation semiconductor packages.
14/08/2008