Microprocessor giant Intel and memory specialist Micron say they have fabricated a 3-bit-per-cell (3bpc) multi-level cell (MLC) NAND memory using 34 nm wafer fabrication. The chips are targeted at consumer storage devices such as flash cards and USB drives, where high density and cost-efficiency are important.
The companies claim the technology produces “the industry’s smallest and most cost-effective 32 gigabit chip currently available. The 32 Gb device covers an area of 126 mm². Micron is currently sampling and will be in mass production in the fourth quarter 2009.
“We see 3bpc NAND technology as an important piece of our roadmap,” says Brian Shirley, vice president of Micron’s memory group. “We also continue to move forward on further shrinks in NAND.”
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