CAMBRIDGE Nanotherm has announced the first ever chip-on-heatsink modules have been shipped to a customer in the LED industry.
The chip-on-heatsink technology was supplied to the customer in partnership with Optocap, an advanced microelectronic and optoelectronic packaging design and assembly company.
Optocap specified Cambridge Nanotherms’ technology for a project due to the outstanding thermal performance it enables. It also means a reduced bill of materials, simplified supplier management and easier assembly.
Cambridge Nanotherm’s core IP is a unique process for converting aluminium into alumina. The process allows the surface of any aluminium object to be converted into a dielectric layer.
In the case of the Chip-on-Heatsink approach, an extruded heat sink or heat pipe can be coated and then metallised with the end user’s circuit design. Nanotherm’s technology enabled Optocap to utilise its advanced manufacturing processes, allowing direct assembly of die and surface mount components onto the heat sink, creating a fully integrated module.
This approach gives a number of benefits for LED lighting customers. By removing both MCPCB and thermal interface material (TIM) components, cost is lowered. The removal of these layers also give the most efficient thermal path between component and heat sink.
By minimising thermal resistance, denser component layouts can be realised. For those using thick-film or thin-film metallised alumina and aluminium nitride ceramic heat sinks, the cost reduction is even more significant.