IMEC and CEA-LETI has launched PIXfab, the continuation of their multi-project wafer silicon photonics prototyping service started in 2006.
IMEC is developing a new method to produce ~50µm thin crystalline silicon wafers for use in solar cells.
European independent research centre in nanoelectronics, Imec, and Aixtron have demonstrated the growth of high-quality and uniform AlGaN/GaN heterostructures on 200mm silicon wafers.
eASIC Corp announced that it has raised US$48 million in late stage financing. The financing round was lead by Advanced Equities Inc, and previous investors Khosla Ventures, Kleiner Perkins Caufield and Byers, Crescendo Ventures and Evergreen Venture Partners also participated. eASIC’s CFO, Craig
Pressure is mounting for semiconductor silicon wafer manufacturers that have been struggling for the past several years due to the large investments that were required to install new 300-mm capacity.
A breakthrough transistor—the fundamental building block of integrated circuit (IC) chips used in electronic devices—that promises a significant increase in computing power will be engineered in Singapore. Unisantis Electronics (Japan) Ltd and the Institute of Microelectronics (IME) announced a
Thanks in part to a breakthrough by IBM scientists, supercomputers that consist of thousands of individual processor “brains” connected by miles of copper wires could one day fit into a laptop PC; and while today’s supercomputers can use the equivalent energy required to power hundreds of homes,
Microsemi Corporation has announced that the Air Force Research Laboratory (AFRL) has awarded US$1.6 million to allow Microsemi’s Power Products Group to develop technology related to the use of silicon carbide RF Power semiconductor components in military avionics applications.
Alcatel Micro Machining Systems announced that it has received an order from STMicroelectronics SAS in Tours (ST) for its new AMS 4200 production tool for advanced device technology.
Microsemi Corporation and SemiSouth Laboratories Inc. announced that they have entered into an agreement which provides for cooperation between the two companies in the area of silicon carbide (SiC) epitaxy wafer supply as well as certain technical exchanges.