“the choice of brooks as a substrate-handlingautomation partner became obvious when we decided to enter the volume production market with our new AMS 3200 and AMS 4200 multi chamber DRIE/PECVD platforms for MEMS and 3D Semiconductors,“ said Jean-Marc Gruffat, director of product at Alcatel Micro Machining Systems.
“Simply because we wanted to concentrate our development efforts in providing the most recent process capabilities in DRIE for etching Silicon materials and Glass-like materials as well as PECVD solutions for depositing SiO2 and Si3N4 isolation layers”.
According to the company, the AMS 3200 is a cost effective cluster tool platform with 3 positions available for Process Modules. It incorporates a single vacuum cassette station with manual door and a single end effector vacuum transfer arm.
The AMS 4200 is a volume production cluster platform with a capacity for up to 4 Process Modules featuring a dual vacuum cassette with automatic doors, dual end effector vacuum robot handling and a built in buffer station.
Each handling module is built on the Brooks Marathon Express MX 400 and MX 600 field-proven vacuum handling stations, compatible with the highest Quality and Semiconductor Standards, the company said.